ETS will host a paper and presentation track dedicated to industrial contributions. Works applicable to this track are all referring to report novel industry practices in test and new ideas in early stage of development where preliminary results are available. Moreover, all papers with at least one contributor from the industry, submitted for inclusion in the main programs but not accepted will be eligible for inclusion in the industrial track. You are invited to participate and submit your contributions to the industrial track of ETS’26. In addition to the regular topics, topics of interest include (but are not limited to) the following topics:

• Analog, mixed signal and RF test
• Test of very high-power devices for EVs, industrial and computing applications test (Hot topic)
• Processor and microcontroller test
• Thermal management during test (Hot topic)
• Screening of defectivity introduced at back-end assembly
• Reliability testing
• Package-level test: SLT, ATE, burn-in optimization methods (Hot topic)
• Wafer-level probe: full wafer, multi-site, singulated die test solutions
• ATE solutions
• Test economics